LTC2963IUDC-1#PBF
vs
TPS3850G25QDRCRQ1
feature comparison
| Pbfree Code |
No
|
Yes
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
ANALOG DEVICES INC
|
TEXAS INSTRUMENTS INC
|
| Package Description |
QFN-20
|
VSON-10
|
| Pin Count |
20
|
|
| Manufacturer Package Code |
05-08-1752
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| Date Of Intro |
2018-08-02
|
2017-02-01
|
| Samacsys Manufacturer |
Analog Devices
|
Texas Instruments
|
| Adjustable Threshold |
YES
|
YES
|
| Analog IC - Other Type |
POWER SUPPLY MANAGEMENT CIRCUIT
|
POWER SUPPLY MANAGEMENT CIRCUIT
|
| JESD-30 Code |
R-PQCC-N20
|
S-PDSO-N10
|
| JESD-609 Code |
e3
|
e4
|
| Length |
4 mm
|
3 mm
|
| Moisture Sensitivity Level |
1
|
2
|
| Number of Channels |
1
|
1
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
20
|
10
|
| Operating Temperature-Max |
85 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
HVQCCN
|
HVSON
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Seated Height-Max |
0.8 mm
|
1 mm
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
6.5 V
|
| Supply Voltage-Min (Vsup) |
2.25 V
|
1.6 V
|
| Supply Voltage-Nom (Vsup) |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
|
| Temperature Grade |
INDUSTRIAL
|
AUTOMOTIVE
|
| Terminal Finish |
Matte Tin (Sn)
|
NICKEL PALLADIUM GOLD
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Width |
3 mm
|
3 mm
|
| Base Number Matches |
1
|
1
|
| ECCN Code |
|
EAR99
|
| Screening Level |
|
AEC-Q100
|
| Supply Current-Max (Isup) |
|
0.019 mA
|
|
|
|
Compare LTC2963IUDC-1#PBF with alternatives
Compare TPS3850G25QDRCRQ1 with alternatives