LTC3209EUF-1#TRPBF
vs
LTC3209EUF-1#TRPBF
feature comparison
| Pbfree Code |
No
|
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Transferred
|
| Ihs Manufacturer |
ANALOG DEVICES INC
|
LINEAR TECHNOLOGY CORP
|
| Package Description |
4 X 4 MM, LEAD FREE, PLASTIC, MO-220WGGD-1, QFN-20
|
4 X 4 MM, LEAD FREE, PLASTIC, MO-220WGGD-1, QFN-20
|
| Pin Count |
20
|
20
|
| Manufacturer Package Code |
05-08-1710
|
UF
|
| Reach Compliance Code |
compliant
|
compliant
|
| Data Input Mode |
SERIAL
|
SERIAL
|
| Interface IC Type |
LED DISPLAY DRIVER
|
LED DISPLAY DRIVER
|
| JESD-30 Code |
S-PQCC-N20
|
S-PQCC-N20
|
| JESD-609 Code |
e3
|
e3
|
| Length |
4 mm
|
4 mm
|
| Moisture Sensitivity Level |
1
|
1
|
| Multiplexed Display Capability |
NO
|
NO
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
20
|
20
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
HVQCCN
|
HVQCCN
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
0.8 mm
|
0.8 mm
|
| Supply Voltage-Max |
4.5 V
|
4.5 V
|
| Supply Voltage-Min |
1.5 V
|
1.5 V
|
| Supply Voltage-Nom |
3 V
|
3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
Matte Tin (Sn) - annealed
|
Matte Tin (Sn)
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Width |
4 mm
|
4 mm
|
| Base Number Matches |
1
|
1
|
| Part Package Code |
|
QFN
|
| ECCN Code |
|
EAR99
|
| HTS Code |
|
8542.39.00.01
|
| Package Equivalence Code |
|
LCC20,.16SQ,20
|
|
|
|
Compare LTC3209EUF-1#TRPBF with alternatives
Compare LTC3209EUF-1#TRPBF with alternatives