M29W160DB70ZA1E vs AM29LV160DT70WCE feature comparison

M29W160DB70ZA1E STMicroelectronics

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AM29LV160DT70WCE Spansion

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Rohs Code Yes No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer STMICROELECTRONICS SPANSION INC
Part Package Code BGA BGA
Package Description 8 X 9 MM, 0.80 MM PITCH, TFBGA-48 TFBGA,
Pin Count 48 48
Reach Compliance Code compliant compliant
ECCN Code EAR99
HTS Code 8542.32.00.51
Access Time-Max 70 ns 70 ns
Additional Feature BOTTOM BOOT BLOCK EMBEDDED ALGORITHMS; 20 YEARS DATA RETENTION; TOP BOOT BLOCK
Alternate Memory Width 8 8
Boot Block BOTTOM
JESD-30 Code R-PBGA-B48 R-PBGA-B48
JESD-609 Code e1 e0
Length 9 mm 9 mm
Memory Density 16777216 bit 16777216 bit
Memory IC Type FLASH FLASH
Memory Width 16 16
Number of Functions 1 1
Number of Terminals 48 48
Number of Words 1048576 words 1048576 words
Number of Words Code 1000000 1000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 125 °C
Operating Temperature-Min -55 °C
Organization 1MX16 1MX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TFBGA TFBGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY
Parallel/Serial PARALLEL PARALLEL
Programming Voltage 3 V 3 V
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm 1.2 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 3 V 2.7 V
Supply Voltage-Nom (Vsup) 3.3 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL MILITARY
Terminal Finish TIN SILVER COPPER TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Type NOR TYPE
Width 8 mm 8 mm
Base Number Matches 1 2
Moisture Sensitivity Level 3
Peak Reflow Temperature (Cel) 240
Time@Peak Reflow Temperature-Max (s) 30

Compare M29W160DB70ZA1E with alternatives

Compare AM29LV160DT70WCE with alternatives