M38510/31301BCX vs SN74LS13N feature comparison

M38510/31301BCX Lansdale Semiconductor Inc

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SN74LS13N Freescale Semiconductor

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Part Life Cycle Code Active Obsolete
Ihs Manufacturer LANSDALE SEMICONDUCTOR INC MOTOROLA SEMICONDUCTOR PRODUCTS
Part Package Code DIP
Package Description DIP, DIP, DIP14,.3
Pin Count 14
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01
Family LS
JESD-30 Code R-GDIP-T14 R-PDIP-T14
Logic IC Type NAND GATE NAND GATE
Number of Functions 2
Number of Inputs 4
Number of Terminals 14 14
Operating Temperature-Max 125 °C 70 °C
Operating Temperature-Min -55 °C
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Propagation Delay (tpd) 52 ns
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology TTL TTL
Temperature Grade MILITARY COMMERCIAL
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position DUAL DUAL
Base Number Matches 6 6
Rohs Code No
JESD-609 Code e0
Max I(ol) 0.008 A
Package Equivalence Code DIP14,.3
Power Supplies 5 V
Power Supply Current-Max (ICC) 7 mA
Prop. Delay@Nom-Sup 27 ns
Schmitt Trigger YES
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Pitch 2.54 mm

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