MAX11060GUU+
vs
MAX11060GUU+T
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
ANALOG DEVICES INC
|
|
Part Package Code |
38-TSSOP_4.4-4.4_MM
|
38-TSSOP_4.4-4.4_MM
|
Package Description |
ROHS COMPLIANT, TSSOP-38
|
|
Pin Count |
38
|
38
|
Manufacturer Package Code |
38-TSSOP_4.4-4.4_MM
|
38-TSSOP_4.4-4.4_MM
|
Reach Compliance Code |
compliant
|
|
Date Of Intro |
2011-03-07
|
2011-03-07
|
Samacsys Manufacturer |
Analog Devices
|
Analog Devices
|
Analog Input Voltage-Max |
2.2 V
|
2.2 V
|
Analog Input Voltage-Min |
-2.2 V
|
-2.2 V
|
Converter Type |
ADC, DELTA-SIGMA
|
A/D CONVERTER
|
JESD-30 Code |
R-PDSO-G38
|
R-PDSO-G38
|
JESD-609 Code |
e3
|
e3
|
Length |
9.7 mm
|
9.7 mm
|
Moisture Sensitivity Level |
3
|
3
|
Number of Analog In Channels |
4
|
4
|
Number of Bits |
16
|
16
|
Number of Functions |
1
|
1
|
Number of Terminals |
38
|
38
|
Operating Temperature-Max |
105 °C
|
105 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Output Bit Code |
2'S COMPLEMENT BINARY
|
2'S COMPLEMENT BINARY
|
Output Format |
SERIAL
|
SERIAL
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
TSSOP
|
TSSOP
|
Package Equivalence Code |
TSSOP38,.25,20
|
TSSOP38,.25,20
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Sample Rate |
3.072 MHz
|
3.072 MHz
|
Sample and Hold / Track and Hold |
TRACK
|
TRACK
|
Seated Height-Max |
1.1 mm
|
1.1 mm
|
Supply Voltage-Nom |
3.3 V
|
|
Surface Mount |
YES
|
YES
|
Technology |
BICMOS
|
BICMOS
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
Matte Tin (Sn)
|
Matte Tin (Sn)
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.5 mm
|
0.5 mm
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
Width |
4.4 mm
|
4.4 mm
|
Base Number Matches |
2
|
1
|
|
|
|