MAX14839GWC+T
vs
MAX14838GWC+
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Transferred
|
| Part Package Code |
12-WLCSP-N/A
|
|
| Pin Count |
12
|
|
| Manufacturer Package Code |
12-WLCSP-N/A
|
|
| Date Of Intro |
2014-12-23
|
|
| Samacsys Manufacturer |
Analog Devices
|
|
| Interface IC Type |
INTERFACE CIRCUIT
|
INTERFACE CIRCUIT
|
| JESD-30 Code |
R-PBGA-B12
|
R-PBGA-B12
|
| JESD-609 Code |
e1
|
e1
|
| Length |
2.215 mm
|
2.215 mm
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
12
|
12
|
| Operating Temperature-Max |
105 °C
|
105 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
VFBGA
|
VFBGA
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Seated Height-Max |
0.69 mm
|
0.69 mm
|
| Supply Voltage-Max |
34 V
|
34 V
|
| Supply Voltage-Min |
4.75 V
|
7 V
|
| Supply Voltage-Nom |
24 V
|
24 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
BICMOS
|
BICMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
Tin/Silver/Copper (Sn/Ag/Cu)
|
TIN SILVER COPPER
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Width |
1.885 mm
|
1.885 mm
|
| Base Number Matches |
1
|
2
|
| Ihs Manufacturer |
|
MAXIM INTEGRATED PRODUCTS INC
|
| Package Description |
|
VFBGA,
|
| Reach Compliance Code |
|
compliant
|
| HTS Code |
|
8542.39.00.01
|
|
|
|
Compare MAX14839GWC+T with alternatives
Compare MAX14838GWC+ with alternatives