MAX16814BUUP+
vs
MAX16814ATP/V
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Active
|
Transferred
|
| Ihs Manufacturer |
ANALOG DEVICES INC
|
MAXIM INTEGRATED PRODUCTS INC
|
| Part Package Code |
20-TSSOP_4.4_EP-4.4_MM
|
QFN
|
| Package Description |
6.50 X 4.40 MM, ROHS COMPLIANT, TSSOP-20
|
HVQCCN,
|
| Pin Count |
20
|
20
|
| Manufacturer Package Code |
20-TSSOP_4.4_EP-4.4_MM
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| Date Of Intro |
2009-08-21
|
|
| Samacsys Manufacturer |
Analog Devices
|
|
| Interface IC Type |
LED DISPLAY DRIVER
|
LED DISPLAY DRIVER
|
| JESD-30 Code |
R-PDSO-G20
|
S-XQCC-N20
|
| JESD-609 Code |
e3
|
|
| Length |
6.5 mm
|
4 mm
|
| Moisture Sensitivity Level |
1
|
|
| Multiplexed Display Capability |
NO
|
NO
|
| Number of Functions |
1
|
1
|
| Number of Segments |
4
|
28
|
| Number of Terminals |
20
|
20
|
| Operating Temperature-Max |
85 °C
|
125 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
UNSPECIFIED
|
| Package Code |
HTSSOP
|
HVQCCN
|
| Package Equivalence Code |
TSSOP20,.25
|
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
SMALL OUTLINE
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Peak Reflow Temperature (Cel) |
260
|
NOT SPECIFIED
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.1 mm
|
0.8 mm
|
| Supply Voltage-Nom |
12 V
|
12 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
BCDMOS
|
BCDMOS
|
| Temperature Grade |
OTHER
|
AUTOMOTIVE
|
| Terminal Finish |
Matte Tin (Sn)
|
|
| Terminal Form |
GULL WING
|
NO LEAD
|
| Terminal Pitch |
0.65 mm
|
0.5 mm
|
| Terminal Position |
DUAL
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
NOT SPECIFIED
|
| Width |
4.4 mm
|
4 mm
|
| Base Number Matches |
2
|
7
|
| ECCN Code |
|
EAR99
|
| HTS Code |
|
8542.39.00.01
|
| Screening Level |
|
AEC-Q100
|
| Supply Voltage-Max |
|
40 V
|
| Supply Voltage-Min |
|
4.75 V
|
|
|
|
Compare MAX16814BUUP+ with alternatives
Compare MAX16814ATP/V with alternatives