MAX1856EUB+T
vs
MIC2196YM
feature comparison
Pbfree Code |
Yes
|
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Transferred
|
Active
|
Ihs Manufacturer |
MAXIM INTEGRATED PRODUCTS INC
|
MICROCHIP TECHNOLOGY INC
|
Part Package Code |
SOIC
|
|
Package Description |
TSSOP, TSSOP10,.19,20
|
SOP,
|
Pin Count |
10
|
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Analog IC - Other Type |
SWITCHING CONTROLLER
|
SWITCHING CONTROLLER
|
Control Mode |
CURRENT-MODE
|
CURRENT-MODE
|
Control Technique |
PULSE WIDTH MODULATION
|
PULSE WIDTH MODULATION
|
Input Voltage-Max |
28 V
|
14 V
|
Input Voltage-Min |
3 V
|
2.9 V
|
Input Voltage-Nom |
5 V
|
5 V
|
JESD-30 Code |
S-PDSO-G10
|
R-PDSO-G8
|
JESD-609 Code |
e3
|
e4
|
Length |
3 mm
|
4.93 mm
|
Moisture Sensitivity Level |
1
|
1
|
Number of Functions |
1
|
1
|
Number of Terminals |
10
|
8
|
Operating Temperature-Max |
85 °C
|
125 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
TSSOP
|
SOP
|
Package Equivalence Code |
TSSOP10,.19,20
|
SOP8,.25
|
Package Shape |
SQUARE
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.1 mm
|
1.73 mm
|
Surface Mount |
YES
|
YES
|
Switcher Configuration |
SINGLE
|
BOOST
|
Switching Frequency-Max |
575 kHz
|
440 kHz
|
Technology |
BICMOS
|
BICMOS
|
Temperature Grade |
INDUSTRIAL
|
AUTOMOTIVE
|
Terminal Finish |
MATTE TIN
|
NICKEL PALLADIUM GOLD
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.5 mm
|
1.27 mm
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
Width |
3 mm
|
3.94 mm
|
Base Number Matches |
2
|
3
|
Factory Lead Time |
|
7 Weeks
|
Samacsys Manufacturer |
|
Microchip
|
Output Voltage-Nom |
|
12 V
|
|
|
|
Compare MAX1856EUB+T with alternatives
Compare MIC2196YM with alternatives