MAX3983UGK+D
vs
TUSB212QRWBRQ1
feature comparison
Rohs Code |
Yes
|
|
Part Life Cycle Code |
Active
|
|
Ihs Manufacturer |
ANALOG DEVICES INC
|
|
Part Package Code |
68-LFCSP-10X10X0.85
|
|
Package Description |
10 X 10 MM, 0.90 MM HEIGHT, ROHS COMPLIANT, MO-220, QFN-68
|
|
Pin Count |
68
|
|
Manufacturer Package Code |
68-LFCSP-10X10X0.85
|
|
Reach Compliance Code |
compliant
|
|
Date Of Intro |
2003-08-11
|
|
Samacsys Manufacturer |
Analog Devices
|
|
JESD-30 Code |
S-XQCC-N68
|
|
JESD-609 Code |
e3
|
|
Length |
10 mm
|
|
Moisture Sensitivity Level |
3
|
|
Number of Functions |
1
|
|
Number of Terminals |
68
|
|
Operating Temperature-Max |
85 °C
|
|
Operating Temperature-Min |
|
|
Package Body Material |
UNSPECIFIED
|
|
Package Code |
HVQCCN
|
|
Package Equivalence Code |
LCC68,.4SQ,20
|
|
Package Shape |
SQUARE
|
|
Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
|
Peak Reflow Temperature (Cel) |
260
|
|
Qualification Status |
Not Qualified
|
|
Seated Height-Max |
0.9 mm
|
|
Supply Current-Max |
0.58 mA
|
|
Supply Voltage-Nom |
3.3 V
|
|
Surface Mount |
YES
|
|
Technology |
BIPOLAR
|
|
Telecom IC Type |
TELECOM CIRCUIT
|
|
Temperature Grade |
OTHER
|
|
Terminal Finish |
Matte Tin (Sn)
|
|
Terminal Form |
NO LEAD
|
|
Terminal Pitch |
0.5 mm
|
|
Terminal Position |
QUAD
|
|
Time@Peak Reflow Temperature-Max (s) |
30
|
|
Width |
10 mm
|
|
Base Number Matches |
1
|
|
|
|
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