MAX4372HEBT+T
vs
MAX4372FEBT+T
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Active
|
| Ihs Manufacturer |
MAXIM INTEGRATED PRODUCTS INC
|
ANALOG DEVICES INC
|
| Part Package Code |
BGA
|
6-WLCSP-N/A
|
| Package Description |
UCSP-6
|
1 X 1.50 MM, ROHS COMPLIANT, UCSP-6
|
| Pin Count |
6
|
6
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.33.00.01
|
|
| Factory Lead Time |
4 Weeks
|
|
| Base Number Matches |
3
|
1
|
| Manufacturer Package Code |
|
6-WLCSP-N/A
|
| Date Of Intro |
|
1999-11-11
|
| Samacsys Manufacturer |
|
Analog Devices
|
| Adjustable Threshold |
|
NO
|
| Analog IC - Other Type |
|
POWER SUPPLY SUPPORT CIRCUIT
|
| JESD-30 Code |
|
R-PBGA-B6
|
| JESD-609 Code |
|
e1
|
| Length |
|
1.52 mm
|
| Moisture Sensitivity Level |
|
1
|
| Number of Channels |
|
1
|
| Number of Functions |
|
1
|
| Number of Terminals |
|
6
|
| Operating Temperature-Max |
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Package Body Material |
|
PLASTIC/EPOXY
|
| Package Code |
|
VFBGA
|
| Package Equivalence Code |
|
BGA6,2X3,20
|
| Package Shape |
|
RECTANGULAR
|
| Package Style |
|
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Qualification Status |
|
Not Qualified
|
| Seated Height-Max |
|
0.67 mm
|
| Supply Current-Max (Isup) |
|
0.06 mA
|
| Supply Voltage-Max (Vsup) |
|
28 V
|
| Supply Voltage-Min (Vsup) |
|
2.7 V
|
| Supply Voltage-Nom (Vsup) |
|
12 V
|
| Surface Mount |
|
YES
|
| Technology |
|
BICMOS
|
| Temperature Grade |
|
INDUSTRIAL
|
| Terminal Finish |
|
Tin/Silver/Copper (Sn/Ag/Cu)
|
| Terminal Form |
|
BALL
|
| Terminal Pitch |
|
0.5 mm
|
| Terminal Position |
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
| Width |
|
1 mm
|
|
|
|
Compare MAX4372HEBT+T with alternatives
Compare MAX4372FEBT+T with alternatives