MAX4372HEBT+T
vs
MAX4372TESA
feature comparison
| Pbfree Code |
Yes
|
Yes
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
MAXIM INTEGRATED PRODUCTS INC
|
MAXIM INTEGRATED PRODUCTS INC
|
| Part Package Code |
BGA
|
SOIC
|
| Package Description |
UCSP-6
|
SOP-8
|
| Pin Count |
6
|
8
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.33.00.01
|
8542.33.00.01
|
| Factory Lead Time |
4 Weeks
|
|
| Amplifier Type |
OPERATIONAL AMPLIFIER
|
OPERATIONAL AMPLIFIER
|
| Architecture |
VOLTAGE-FEEDBACK
|
VOLTAGE-FEEDBACK
|
| Average Bias Current-Max (IIB) |
2 µA
|
|
| Bias Current-Max (IIB) @25C |
2 µA
|
|
| Common-mode Reject Ratio-Nom |
85 dB
|
85 dB
|
| Frequency Compensation |
YES
|
YES
|
| Input Offset Voltage-Max |
1900 µV
|
1100 µV
|
| JESD-30 Code |
R-PBGA-B6
|
R-PDSO-G8
|
| Length |
1.52 mm
|
4.9 mm
|
| Low-Bias |
NO
|
NO
|
| Low-Offset |
NO
|
NO
|
| Micropower |
NO
|
NO
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
6
|
8
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
VFBGA
|
SOP
|
| Package Equivalence Code |
BGA6,2X3,20
|
SOP8,.25
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
SMALL OUT LINE
|
| Packing Method |
TR
|
TR
|
| Power |
NO
|
NO
|
| Programmable Power |
NO
|
NO
|
| Seated Height-Max |
0.67 mm
|
1.75 mm
|
| Supply Current-Max |
0.06 mA
|
0.06 mA
|
| Supply Voltage Limit-Max |
30 V
|
30 V
|
| Supply Voltage-Nom (Vsup) |
12 V
|
12 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
BICMOS
|
BICMOS
|
| Terminal Form |
BALL
|
GULL WING
|
| Terminal Pitch |
0.5 mm
|
1.27 mm
|
| Terminal Position |
BOTTOM
|
DUAL
|
| Wideband |
NO
|
NO
|
| Width |
1 mm
|
3.9 mm
|
| Base Number Matches |
3
|
2
|
|
|
|
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