MAX4781EGE+
vs
MAX4781EGE
feature comparison
Rohs Code |
Yes
|
No
|
Part Life Cycle Code |
Active
|
Obsolete
|
Part Package Code |
16-LFCSP-4X4X0.85
|
QFN
|
Pin Count |
16
|
16
|
Manufacturer Package Code |
16-LFCSP-4X4X0.85
|
|
Date Of Intro |
2002-08-09
|
|
Samacsys Manufacturer |
Analog Devices
|
|
Analog IC - Other Type |
SINGLE-ENDED MULTIPLEXER
|
SINGLE-ENDED MULTIPLEXER
|
JESD-609 Code |
e3
|
e0
|
Moisture Sensitivity Level |
1
|
1
|
Peak Reflow Temperature (Cel) |
260
|
|
Terminal Finish |
Matte Tin (Sn)
|
TIN LEAD
|
Time@Peak Reflow Temperature-Max (s) |
30
|
|
Base Number Matches |
2
|
4
|
Pbfree Code |
|
No
|
Ihs Manufacturer |
|
MAXIM INTEGRATED PRODUCTS INC
|
Package Description |
|
4 X 4 MM, 0.90 MM HEIGHT, QFN-16
|
Reach Compliance Code |
|
not_compliant
|
ECCN Code |
|
EAR99
|
HTS Code |
|
8542.39.00.01
|
Factory Lead Time |
|
4 Weeks
|
JESD-30 Code |
|
S-XQCC-N16
|
Length |
|
4 mm
|
Number of Channels |
|
8
|
Number of Functions |
|
1
|
Number of Terminals |
|
16
|
Off-state Isolation-Nom |
|
75 dB
|
On-state Resistance Match-Nom |
|
0.3 Ω
|
On-state Resistance-Max (Ron) |
|
1 Ω
|
Operating Temperature-Max |
|
85 °C
|
Operating Temperature-Min |
|
-40 °C
|
Package Body Material |
|
UNSPECIFIED
|
Package Code |
|
HVQCCN
|
Package Equivalence Code |
|
LCC16,.16SQ,25
|
Package Shape |
|
SQUARE
|
Package Style |
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
Qualification Status |
|
Not Qualified
|
Seated Height-Max |
|
1 mm
|
Signal Current-Max |
|
0.01 A
|
Supply Current-Max (Isup) |
|
0.001 mA
|
Supply Voltage-Max (Vsup) |
|
3.6 V
|
Supply Voltage-Min (Vsup) |
|
1.6 V
|
Supply Voltage-Nom (Vsup) |
|
3 V
|
Surface Mount |
|
YES
|
Switch-off Time-Max |
|
15 ns
|
Switch-on Time-Max |
|
25 ns
|
Switching |
|
BREAK-BEFORE-MAKE
|
Technology |
|
CMOS
|
Temperature Grade |
|
INDUSTRIAL
|
Terminal Form |
|
NO LEAD
|
Terminal Pitch |
|
0.65 mm
|
Terminal Position |
|
QUAD
|
Width |
|
4 mm
|
|
|
|
Compare MAX4781EGE+ with alternatives
Compare MAX4781EGE with alternatives