MAX5815BAUD+
vs
MAX5815BAUD+T
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
ANALOG DEVICES INC
|
|
| Part Package Code |
14-TSSOP_4.4-4.4_MM
|
14-TSSOP_4.4-4.4_MM
|
| Pin Count |
14
|
14
|
| Manufacturer Package Code |
14-TSSOP_4.4-4.4_MM
|
14-TSSOP_4.4-4.4_MM
|
| Reach Compliance Code |
compliant
|
|
| Date Of Intro |
2012-02-28
|
2012-02-28
|
| Samacsys Manufacturer |
Analog Devices
|
Analog Devices
|
| Converter Type |
D/A CONVERTER
|
D/A CONVERTER
|
| Input Bit Code |
BINARY
|
BINARY
|
| JESD-30 Code |
R-PDSO-G14
|
R-PDSO-G14
|
| JESD-609 Code |
e3
|
e3
|
| Linearity Error-Max (EL) |
0.024%
|
0.024%
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Bits |
12
|
12
|
| Number of Functions |
4
|
4
|
| Number of Terminals |
14
|
14
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TSSOP
|
TSSOP
|
| Package Equivalence Code |
TSSOP14,.25
|
TSSOP14,.25
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Supply Current-Max |
1.4 mA
|
1.4 mA
|
| Surface Mount |
YES
|
YES
|
| Technology |
BICMOS
|
BICMOS
|
| Temperature Grade |
AUTOMOTIVE
|
AUTOMOTIVE
|
| Terminal Finish |
Matte Tin (Sn) - annealed
|
Matte Tin (Sn)
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.635 mm
|
0.635 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Base Number Matches |
2
|
1
|
|
|
|
Compare MAX5815BAUD+ with alternatives
Compare MAX5815BAUD+T with alternatives