MAX9700AEUB+
vs
SSM2305CPZ-REEL
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Obsolete
|
Ihs Manufacturer |
ANALOG DEVICES INC
|
ANALOG DEVICES INC
|
Part Package Code |
10-MINI_SO-N/A
|
SON
|
Package Description |
UMAX-10
|
3 X 3 MM, ROHS COMPLIANT, LFCSP-8
|
Pin Count |
10
|
8
|
Manufacturer Package Code |
10-MINI_SO-N/A
|
CP-8-13
|
Reach Compliance Code |
compliant
|
unknown
|
Date Of Intro |
2003-11-14
|
|
Samacsys Manufacturer |
Analog Devices
|
|
Bandwidth-Nom |
22 kHz
|
20 kHz
|
Consumer IC Type |
CLASS D AUDIO AMPLIFIER
|
CLASS D AUDIO AMPLIFIER
|
Gain |
6 dB
|
18 dB
|
JESD-30 Code |
S-PDSO-G10
|
S-XDSO-N8
|
JESD-609 Code |
e3
|
e3
|
Length |
3 mm
|
3 mm
|
Moisture Sensitivity Level |
1
|
3
|
Number of Channels |
1
|
1
|
Number of Functions |
1
|
1
|
Number of Terminals |
10
|
8
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Output Power-Nom |
0.8 W
|
2.8 W
|
Package Body Material |
PLASTIC/EPOXY
|
UNSPECIFIED
|
Package Code |
TSSOP
|
HVSON
|
Package Equivalence Code |
TSSOP10,.19,20
|
SOLCC8,.11,20
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.1 mm
|
0.9 mm
|
Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
Supply Voltage-Min (Vsup) |
2.5 V
|
2.5 V
|
Surface Mount |
YES
|
YES
|
Technology |
BICMOS
|
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
Matte Tin (Sn)
|
Matte Tin (Sn) - annealed
|
Terminal Form |
GULL WING
|
NO LEAD
|
Terminal Pitch |
0.5 mm
|
0.5 mm
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
30
|
|
Width |
3 mm
|
3 mm
|
Base Number Matches |
2
|
2
|
Pbfree Code |
|
No
|
HTS Code |
|
8542.33.00.01
|
Harmonic Distortion |
|
10%
|
|
|
|
Compare MAX9700AEUB+ with alternatives
Compare SSM2305CPZ-REEL with alternatives