MBM29PL160BD75PFTR vs AM29DL163DT70RZC feature comparison

MBM29PL160BD75PFTR Spansion

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AM29DL163DT70RZC AMD

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Rohs Code No
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer SPANSION INC ADVANCED MICRO DEVICES INC
Part Package Code TSOP1 SOIC
Package Description PLASTIC, REVERSE, TSOP1-48 MO-180BA, SSOP-56
Pin Count 48 56
Reach Compliance Code compliant unknown
Access Time-Max 75 ns 70 ns
Alternate Memory Width 8 16
JESD-30 Code R-PDSO-G48 R-PDSO-G56
JESD-609 Code e0
Length 18.4 mm 23.7 mm
Memory Density 16777216 bit 16777216 bit
Memory IC Type FLASH FLASH
Memory Width 16 8
Number of Functions 1 1
Number of Terminals 48 56
Number of Words 1048576 words 2097152 words
Number of Words Code 1000000 2000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min -20 °C
Organization 1MX16 2MX8
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSOP1-R SSOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, SHRINK PITCH
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 240
Programming Voltage 3 V 3 V
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm 2 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 2.7 V 2.7 V
Supply Voltage-Nom (Vsup) 3 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish TIN LEAD
Terminal Form GULL WING GULL WING
Terminal Pitch 0.5 mm 0.8 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30
Width 12 mm 13.3 mm
Base Number Matches 3 1
ECCN Code EAR99
HTS Code 8542.32.00.51
Boot Block TOP
Type NOR TYPE

Compare MBM29PL160BD75PFTR with alternatives

Compare AM29DL163DT70RZC with alternatives