MC12022SLAP vs MC12022AP feature comparison

MC12022SLAP Freescale Semiconductor

Buy Now Datasheet

MC12022AP Motorola Semiconductor Products

Buy Now Datasheet
Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MOTOROLA SEMICONDUCTOR PRODUCTS MOTOROLA INC
Package Description DIP, DIP8,.3 626-05
Reach Compliance Code unknown unknown
JESD-30 Code R-PDIP-T8 R-PDIP-T8
JESD-609 Code e0 e0
Logic IC Type PRESCALER PRESCALER
Max Frequency@Nom-Sup 1100000000 Hz 1100000000 Hz
Number of Terminals 8 8
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP8,.3 DIP8,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Power Supplies 5 V
Power Supply Current-Max (ICC) 6.5 mA 10 mA
Qualification Status Not Qualified Not Qualified
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology ECL BIPOLAR
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish Tin/Lead (Sn/Pb) TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Base Number Matches 3 3
HTS Code 8542.39.00.01
Additional Feature 128/129 DIVIDE RATIO SELECTION IS ALSO POSSIBLE
Family ECL
Length 9.78 mm
Load Capacitance (CL) 12 pF
Number of Data/Clock Inputs 1
Number of Functions 1
Output Characteristics OPEN-EMITTER
Seated Height-Max 4.45 mm
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Width 7.62 mm
fmax-Min 1100 MHz

Compare MC12022AP with alternatives