MC12022SLAP
vs
MC12022AP
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
MOTOROLA SEMICONDUCTOR PRODUCTS
|
MOTOROLA INC
|
| Package Description |
DIP, DIP8,.3
|
626-05
|
| Reach Compliance Code |
unknown
|
unknown
|
| JESD-30 Code |
R-PDIP-T8
|
R-PDIP-T8
|
| JESD-609 Code |
e0
|
e0
|
| Logic IC Type |
PRESCALER
|
PRESCALER
|
| Max Frequency@Nom-Sup |
1100000000 Hz
|
1100000000 Hz
|
| Number of Terminals |
8
|
8
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
DIP
|
| Package Equivalence Code |
DIP8,.3
|
DIP8,.3
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Power Supplies |
5 V
|
|
| Power Supply Current-Max (ICC) |
6.5 mA
|
10 mA
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
ECL
|
BIPOLAR
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
TIN LEAD
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Pitch |
2.54 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Base Number Matches |
3
|
3
|
| HTS Code |
|
8542.39.00.01
|
| Additional Feature |
|
128/129 DIVIDE RATIO SELECTION IS ALSO POSSIBLE
|
| Family |
|
ECL
|
| Length |
|
9.78 mm
|
| Load Capacitance (CL) |
|
12 pF
|
| Number of Data/Clock Inputs |
|
1
|
| Number of Functions |
|
1
|
| Output Characteristics |
|
OPEN-EMITTER
|
| Seated Height-Max |
|
4.45 mm
|
| Supply Voltage-Max (Vsup) |
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
|
4.5 V
|
| Width |
|
7.62 mm
|
| fmax-Min |
|
1100 MHz
|
|
|
|
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