MC12022SLAP
vs
MC12022AP
feature comparison
All Stats
Differences Only
Rohs Code
No
No
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MOTOROLA SEMICONDUCTOR PRODUCTS
MOTOROLA INC
Package Description
DIP, DIP8,.3
626-05
Reach Compliance Code
unknown
unknown
JESD-30 Code
R-PDIP-T8
R-PDIP-T8
JESD-609 Code
e0
e0
Logic IC Type
PRESCALER
PRESCALER
Max Frequency@Nom-Sup
1100000000 Hz
1100000000 Hz
Number of Terminals
8
8
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Equivalence Code
DIP8,.3
DIP8,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Power Supplies
5 V
Power Supply Current-Max (ICC)
6.5 mA
10 mA
Qualification Status
Not Qualified
Not Qualified
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
ECL
BIPOLAR
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
Tin/Lead (Sn/Pb)
TIN LEAD
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Base Number Matches
3
3
HTS Code
8542.39.00.01
Additional Feature
128/129 DIVIDE RATIO SELECTION IS ALSO POSSIBLE
Family
ECL
Length
9.78 mm
Load Capacitance (CL)
12 pF
Number of Data/Clock Inputs
1
Number of Functions
1
Output Characteristics
OPEN-EMITTER
Seated Height-Max
4.45 mm
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Width
7.62 mm
fmax-Min
1100 MHz
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