MC68332GCAG16 vs SPAKMC332MFV16 feature comparison

MC68332GCAG16 NXP Semiconductors

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SPAKMC332MFV16 Motorola Semiconductor Products

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Rohs Code Yes
Part Life Cycle Code Not Recommended Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS MOTOROLA INC
Package Description LFQFP, LFQFP,
Reach Compliance Code compliant unknown
ECCN Code EAR99
HTS Code 8542.31.00.01 8542.31.00.01
Factory Lead Time 13 Weeks
Date Of Intro 1988-01-01
Samacsys Manufacturer NXP
Has ADC NO NO
Address Bus Width 24 24
Bit Size 32 32
Clock Frequency-Max 16 MHz 16.78 MHz
DAC Channels NO NO
DMA Channels NO NO
External Data Bus Width 16 16
JESD-30 Code S-PQFP-G144 S-PQFP-G144
JESD-609 Code e3
Length 20 mm 20 mm
Moisture Sensitivity Level 3
Number of I/O Lines 24 24
Number of Terminals 144 144
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
PWM Channels YES YES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LFQFP LFQFP
Package Shape SQUARE SQUARE
Package Style FLATPACK, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.6 mm 1.6 mm
Speed 16 MHz 16.78 MHz
Supply Voltage-Nom 5 V
Surface Mount YES YES
Technology HCMOS HCMOS
Temperature Grade INDUSTRIAL AUTOMOTIVE
Terminal Finish Tin (Sn)
Terminal Form GULL WING GULL WING
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position QUAD QUAD
Time@Peak Reflow Temperature-Max (s) 40
Width 20 mm 20 mm
uPs/uCs/Peripheral ICs Type MICROCONTROLLER MICROCONTROLLER
Base Number Matches 1 1
Additional Feature EXT 32.768KHZ REFERENCE CRYSTAL; DYNAMIC BUS SIZING; 12 PROGRAMMABLE CHIP SELECT SIGNALS
Boundary Scan NO
Format FIXED POINT
Integrated Cache NO
Low Power Mode YES
Number of DMA Channels
Number of External Interrupts 7
Number of Serial I/Os 3
Number of Timers 1
On Chip Data RAM Width 8
On Chip Program ROM Width
RAM (words) 1024
ROM (words) 0

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