MC68EN360AI25L
vs
MC68EN360AI25L
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
FREESCALE SEMICONDUCTOR INC
|
| Package Description |
QFP-240
|
QFP-240
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
3A991.A.2
|
3A991.A.2
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Samacsys Manufacturer |
NXP
|
NXP
|
| Address Bus Width |
32
|
|
| Boundary Scan |
YES
|
|
| Clock Frequency-Max |
25 MHz
|
|
| Communication Protocol |
ASYNC, BIT; SYNC, BYTE; SYNC, HDLC; SYNC, SDLC; BISYNC
|
|
| Data Transfer Rate-Max |
1.25 MBps
|
|
| External Data Bus Width |
32
|
|
| JESD-30 Code |
S-PQFP-G240
|
S-PQFP-G240
|
| JESD-609 Code |
e3
|
e3
|
| Moisture Sensitivity Level |
3
|
3
|
| Number of Serial I/Os |
1
|
|
| Number of Terminals |
240
|
240
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
QFP
|
QFP
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
FLATPACK
|
FLATPACK
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Terminal Finish |
Tin (Sn)
|
Matte Tin (Sn)
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Position |
QUAD
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
40
|
| uPs/uCs/Peripheral ICs Type |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL
|
RISC MICROCONTROLLER
|
| Base Number Matches |
1
|
1
|
| Pbfree Code |
|
Yes
|
| Part Package Code |
|
QFP
|
| Pin Count |
|
240
|
|
|
|