MC74HC08AFELG vs TC74HC08AFN-ELP feature comparison

MC74HC08AFELG onsemi

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TC74HC08AFN-ELP Toshiba America Electronic Components

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Rohs Code Yes Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer ONSEMI TOSHIBA CORP
Part Package Code SOIC SOIC
Package Description LEAD FREE, EIAJ, SO-14 SOP, SOP14,.25
Pin Count 14 14
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Factory Lead Time 4 Weeks
Samacsys Manufacturer onsemi Toshiba
Family HC/UH HC/UH
JESD-30 Code R-PDSO-G14 R-PDSO-G14
JESD-609 Code e4 e0
Length 10.2 mm 8.65 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type AND GATE AND GATE
Max I(ol) 0.004 A 0.004 A
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Equivalence Code SOP14,.3 SOP14,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Packing Method TR TR
Peak Reflow Temperature (Cel) 260 NOT SPECIFIED
Prop. Delay@Nom-Sup 22 ns 19 ns
Propagation Delay (tpd) 110 ns 19 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger NO NO
Seated Height-Max 2.05 mm 1.75 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 3 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade MILITARY INDUSTRIAL
Terminal Finish NICKEL PALLADIUM GOLD
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Width 5.275 mm 3.9 mm
Base Number Matches 1 1
Pbfree Code No
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

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Compare TC74HC08AFN-ELP with alternatives