MC74HC107N vs HD74HC74TELL feature comparison

MC74HC107N Motorola Semiconductor Products

Buy Now Datasheet

HD74HC74TELL Renesas Electronics Corporation

Buy Now Datasheet
Rohs Code No Yes
Part Life Cycle Code Obsolete Active
Ihs Manufacturer MOTOROLA INC RENESAS ELECTRONICS CORP
Package Description PLASTIC, DIP-14 TSSOP, TSSOP14,.25
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family HC/UH HC/UH
JESD-30 Code R-PDIP-T14 R-PDSO-G14
JESD-609 Code e0
Length 18.86 mm 5 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type J-K FLIP-FLOP D FLIP-FLOP
Number of Bits 2 1
Number of Functions 2 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Output Polarity COMPLEMENTARY COMPLEMENTARY
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP TSSOP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Propagation Delay (tpd) 38 ns 200 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.69 mm 1.1 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 4.5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade MILITARY INDUSTRIAL
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 0.65 mm
Terminal Position DUAL DUAL
Trigger Type NEGATIVE EDGE POSITIVE EDGE
Width 7.62 mm 4.4 mm
fmax-Min 20 MHz
Base Number Matches 4 1
Pbfree Code Yes
Part Package Code TSSOP
Pin Count 14
Max Frequency@Nom-Sup 20000000 Hz
Max I(ol) 0.004 A
Moisture Sensitivity Level 1
Package Equivalence Code TSSOP14,.25
Packing Method TR
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 20

Compare MC74HC107N with alternatives

Compare HD74HC74TELL with alternatives