MC9328MXLVM20
vs
MC9328MX1DVM20R2
feature comparison
| Pbfree Code |
Yes
|
Yes
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
ROCHESTER ELECTRONICS LLC
|
NXP SEMICONDUCTORS
|
| Part Package Code |
BGA
|
|
| Package Description |
14 X 14 MM, 1.30 MM HEIGHT, 0.80 MM PITCH, ROHS COMPLIANT, MAPBGA-256
|
|
| Pin Count |
256
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| Additional Feature |
ALSO REQUIRES 3.3V SUPPLY
|
|
| Address Bus Width |
25
|
|
| Bit Size |
32
|
|
| Boundary Scan |
YES
|
|
| Clock Frequency-Max |
16 MHz
|
|
| External Data Bus Width |
32
|
|
| Format |
FIXED POINT
|
|
| Integrated Cache |
YES
|
|
| JESD-30 Code |
S-PBGA-B256
|
|
| JESD-609 Code |
e1
|
e1
|
| Length |
14 mm
|
|
| Low Power Mode |
YES
|
|
| Moisture Sensitivity Level |
3
|
3
|
| Number of Terminals |
256
|
|
| Operating Temperature-Max |
70 °C
|
|
| Operating Temperature-Min |
|
|
| Package Body Material |
PLASTIC/EPOXY
|
|
| Package Code |
LFBGA
|
|
| Package Shape |
SQUARE
|
|
| Package Style |
GRID ARRAY, LOW PROFILE, FINE PITCH
|
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Qualification Status |
COMMERCIAL
|
|
| Seated Height-Max |
1.6 mm
|
|
| Speed |
200 MHz
|
|
| Supply Voltage-Max |
2 V
|
|
| Supply Voltage-Min |
1.8 V
|
|
| Supply Voltage-Nom |
1.9 V
|
|
| Surface Mount |
YES
|
|
| Temperature Grade |
COMMERCIAL
|
|
| Terminal Finish |
TIN SILVER COPPER
|
Tin/Silver/Copper (Sn/Ag/Cu)
|
| Terminal Form |
BALL
|
|
| Terminal Pitch |
0.8 mm
|
|
| Terminal Position |
BOTTOM
|
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
40
|
| Width |
14 mm
|
|
| uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR, RISC
|
|
| Base Number Matches |
5
|
4
|
| Factory Lead Time |
|
2 Days
|
| Samacsys Manufacturer |
|
NXP
|
|
|
|