MCF5235CVM100 vs MCF5233CVM100 feature comparison

MCF5235CVM100 Motorola Mobility LLC

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MCF5233CVM100 Rochester Electronics LLC

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Part Life Cycle Code Transferred Active
Ihs Manufacturer MOTOROLA INC ROCHESTER ELECTRONICS INC
Part Package Code BGA BGA
Package Description LBGA, LBGA,
Pin Count 256 256
Reach Compliance Code unknown unknown
ECCN Code 3A991.A.2
HTS Code 8542.31.00.01
Address Bus Width 24 24
Bit Size 32 32
Boundary Scan YES YES
Clock Frequency-Max 75 MHz 75 MHz
External Data Bus Width 32 32
Format FIXED POINT FIXED POINT
Integrated Cache YES YES
JESD-30 Code S-PBGA-B256 S-PBGA-B256
Length 17 mm 17 mm
Low Power Mode YES YES
Number of Terminals 256 256
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA LBGA
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE
Qualification Status Not Qualified COMMERCIAL
Seated Height-Max 1.6 mm 1.6 mm
Speed 100 MHz 100 MHz
Supply Voltage-Max 1.65 V 1.65 V
Supply Voltage-Min 1.35 V 1.35 V
Surface Mount YES YES
Technology CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 17 mm 17 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Base Number Matches 4 5

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