MCF5274LVM166
vs
MC68SZ328VH66V
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
MOTOROLA INC
|
FREESCALE SEMICONDUCTOR INC
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Bit Size |
32
|
|
| JESD-30 Code |
S-PBGA-B196
|
S-PBGA-B196
|
| Number of Terminals |
196
|
196
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
BGA
|
LFBGA
|
| Package Equivalence Code |
BGA196,14X14,40
|
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY
|
GRID ARRAY, LOW PROFILE, FINE PITCH
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Speed |
166 MHz
|
66.32 MHz
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
HCMOS
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
1 mm
|
0.8 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR, RISC
|
MICROPROCESSOR
|
| Base Number Matches |
3
|
3
|
| Part Package Code |
|
BGA
|
| Package Description |
|
12 X 12 MM, 0.80 MM PITCH, MAPBGA-196
|
| Pin Count |
|
196
|
| Address Bus Width |
|
25
|
| Boundary Scan |
|
NO
|
| Clock Frequency-Max |
|
16 MHz
|
| External Data Bus Width |
|
16
|
| Format |
|
FIXED POINT
|
| Integrated Cache |
|
NO
|
| Length |
|
12 mm
|
| Low Power Mode |
|
YES
|
| Seated Height-Max |
|
1.36 mm
|
| Supply Voltage-Max |
|
3.3 V
|
| Supply Voltage-Min |
|
2.7 V
|
| Supply Voltage-Nom |
|
3 V
|
| Width |
|
12 mm
|
|
|
|
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