MCF5274LVM166
vs
MCF5274LCVM166
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
MOTOROLA INC
|
FREESCALE SEMICONDUCTOR INC
|
| Reach Compliance Code |
unknown
|
compliant
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Bit Size |
32
|
32
|
| JESD-30 Code |
S-PBGA-B196
|
S-PBGA-B196
|
| Number of Terminals |
196
|
196
|
| Operating Temperature-Max |
70 °C
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
BGA
|
LBGA
|
| Package Equivalence Code |
BGA196,14X14,40
|
BGA196,14X14,40
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY
|
GRID ARRAY, LOW PROFILE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Speed |
166 MHz
|
166 MHz
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
1 mm
|
1 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR, RISC
|
MICROPROCESSOR, RISC
|
| Base Number Matches |
3
|
2
|
| Pbfree Code |
|
Yes
|
| Part Package Code |
|
BGA
|
| Package Description |
|
ROHS COMPLIANT, MAPBGA-196
|
| Pin Count |
|
196
|
| ECCN Code |
|
5A992
|
| Samacsys Manufacturer |
|
NXP
|
| Additional Feature |
|
ALSO REQUIRES 3.3V SUPPLY
|
| Address Bus Width |
|
24
|
| Boundary Scan |
|
YES
|
| Clock Frequency-Max |
|
83 MHz
|
| External Data Bus Width |
|
32
|
| Format |
|
FIXED POINT
|
| Integrated Cache |
|
YES
|
| Length |
|
15 mm
|
| Low Power Mode |
|
YES
|
| Moisture Sensitivity Level |
|
3
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Seated Height-Max |
|
1.6 mm
|
| Supply Current-Max |
|
175 mA
|
| Supply Voltage-Max |
|
1.6 V
|
| Supply Voltage-Min |
|
1.4 V
|
| Supply Voltage-Nom |
|
1.5 V
|
| Terminal Finish |
|
TIN SILVER COPPER OVER NICKEL
|
| Time@Peak Reflow Temperature-Max (s) |
|
40
|
| Width |
|
15 mm
|
|
|
|
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