MCF5372LCVM240 vs MCF52277CVM166 feature comparison

MCF5372LCVM240 NXP Semiconductors

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MCF52277CVM166 Freescale Semiconductor

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Rohs Code Yes Yes
Part Life Cycle Code Not Recommended Transferred
Ihs Manufacturer NXP SEMICONDUCTORS FREESCALE SEMICONDUCTOR INC
Package Description 15 X 15 MM, ROHS COMPLIANT, MAPBGA-196 15 X 15 MM, PLASTIC, ROHS COMPLIANT, MAPBGA-196
Reach Compliance Code compliant compliant
ECCN Code 3A991.A.1 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Factory Lead Time 13 Weeks
Samacsys Manufacturer NXP
Address Bus Width 24 24
Bit Size 32 32
Boundary Scan YES YES
Clock Frequency-Max 80 MHz 66.67 MHz
External Data Bus Width 32 32
Format FIXED POINT FIXED POINT
Integrated Cache YES YES
JESD-30 Code S-PBGA-B196 S-PBGA-B196
JESD-609 Code e1
Length 15 mm 15 mm
Low Power Mode YES NO
Moisture Sensitivity Level 3
Number of Terminals 196 196
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 260 NOT SPECIFIED
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.75 mm 1.75 mm
Speed 240 MHz 166.67 MHz
Supply Voltage-Max 1.6 V 1.6 V
Supply Voltage-Min 1.4 V 1.4 V
Supply Voltage-Nom 1.5 V 1.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 40 NOT SPECIFIED
Width 15 mm 15 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Base Number Matches 2 2
Part Package Code BGA
Pin Count 196
Package Equivalence Code BGA196,14X14,40

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