MCP1501T-30E/RW
vs
LM4050AEX3-3.3+
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Transferred
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MAXIM INTEGRATED PRODUCTS INC
|
| Package Description |
WDFN-8
|
TSSOP, TSSOP3/6,.08
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Factory Lead Time |
25 Weeks
|
|
| Date Of Intro |
2016-05-26
|
|
| Samacsys Manufacturer |
Microchip
|
|
| Analog IC - Other Type |
THREE TERMINAL VOLTAGE REFERENCE
|
TWO TERMINAL VOLTAGE REFERENCE
|
| JESD-30 Code |
S-PDSO-N8
|
R-PDSO-G3
|
| JESD-609 Code |
e3
|
e3
|
| Length |
2 mm
|
2 mm
|
| Number of Functions |
1
|
1
|
| Number of Outputs |
1
|
1
|
| Number of Terminals |
8
|
3
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Current-Max |
0.03 A
|
|
| Output Voltage-Max |
3.003 V
|
3.3033 V
|
| Output Voltage-Min |
2.997 V
|
3.2967 V
|
| Output Voltage-Nom |
3 V
|
3.3 V
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
HVSON
|
TSSOP
|
| Package Equivalence Code |
SOLCC8,.08,20
|
TSSOP3/6,.08
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
| Seated Height-Max |
0.8 mm
|
1.1 mm
|
| Supply Current-Max (Isup) |
0.55 mA
|
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
|
| Supply Voltage-Min (Vsup) |
3.2 V
|
|
| Surface Mount |
YES
|
YES
|
| Temp Coef of Voltage-Max |
50 ppm/°C
|
50 ppm/°C
|
| Temperature Grade |
AUTOMOTIVE
|
AUTOMOTIVE
|
| Terminal Finish |
MATTE TIN
|
MATTE TIN
|
| Terminal Form |
NO LEAD
|
GULL WING
|
| Terminal Pitch |
0.5 mm
|
0.65 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Trim/Adjustable Output |
NO
|
NO
|
| Voltage Tolerance-Max |
0.1%
|
0.1%
|
| Width |
2 mm
|
1.25 mm
|
| Base Number Matches |
1
|
6
|
| Pbfree Code |
|
Yes
|
| Part Package Code |
|
SOIC
|
| Pin Count |
|
3
|
| Moisture Sensitivity Level |
|
1
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Qualification Status |
|
Not Qualified
|
| Technology |
|
BICMOS
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare MCP1501T-30E/RW with alternatives
Compare LM4050AEX3-3.3+ with alternatives