MCP1700T-3302E/MB
vs
LP3997MM-3.3
feature comparison
| Pbfree Code |
Yes
|
No
|
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
TEXAS INSTRUMENTS INC
|
| Part Package Code |
SOT-89
|
MSOP
|
| Package Description |
SOT-89, 3 PIN
|
TSSOP, TSSOP8,.19
|
| Pin Count |
3
|
8
|
| Reach Compliance Code |
compliant
|
not_compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Factory Lead Time |
31 Weeks, 4 Days
|
|
| Samacsys Manufacturer |
Microchip
|
Texas Instruments
|
| Adjustability |
FIXED
|
FIXED
|
| Dropout Voltage1-Max |
0.35 V
|
0.4 V
|
| Dropout Voltage1-Nom |
0.178 V
|
0.14 V
|
| Input Voltage Absolute-Max |
6.5 V
|
6.5 V
|
| Input Voltage-Max |
6 V
|
6 V
|
| Input Voltage-Min |
4.3 V
|
2 V
|
| JESD-30 Code |
R-PSSO-F3
|
S-PDSO-G8
|
| JESD-609 Code |
e3
|
e0
|
| Length |
4.5 mm
|
3 mm
|
| Line Regulation-Max |
0.1089%
|
0.0168%
|
| Load Regulation-Max |
0.0495%
|
0.0199%
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Functions |
1
|
1
|
| Number of Outputs |
1
|
1
|
| Number of Terminals |
3
|
8
|
| Operating Temperature TJ-Max |
125 °C
|
125 °C
|
| Operating Temperature TJ-Min |
-40 °C
|
-40 °C
|
| Output Current1-Max |
0.25 A
|
0.25 A
|
| Output Voltage1-Max |
3.399 V
|
3.399 V
|
| Output Voltage1-Min |
3.201 V
|
3.201 V
|
| Output Voltage1-Nom |
3.3 V
|
3.3 V
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
LSOF
|
TSSOP
|
| Package Equivalence Code |
TO-243
|
TSSOP8,.19
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
SMALL OUTLINE, LOW PROFILE
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
| Packing Method |
TR
|
TR
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Regulator Type |
FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR
|
FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR
|
| Screening Level |
AEC-Q100; TS 16949
|
|
| Seated Height-Max |
1.6 mm
|
1.09 mm
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Terminal Finish |
Matte Tin (Sn) - annealed
|
TIN LEAD
|
| Terminal Form |
FLAT
|
GULL WING
|
| Terminal Pitch |
1.5 mm
|
0.65 mm
|
| Terminal Position |
SINGLE
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
|
| Voltage Tolerance-Max |
3%
|
3%
|
| Width |
2.5 mm
|
3 mm
|
| Base Number Matches |
3
|
2
|
|
|
|
Compare MCP1700T-3302E/MB with alternatives
Compare LP3997MM-3.3 with alternatives