MCP6002T-I/P
vs
MCP6002T-E/MSVAO
feature comparison
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
| Package Description |
,
|
TSSOP, TSSOP8,.19
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.33.00.01
|
8542.33.00.01
|
| Amplifier Type |
OPERATIONAL AMPLIFIER
|
OPERATIONAL AMPLIFIER
|
| Base Number Matches |
1
|
1
|
| Rohs Code |
|
Yes
|
| Samacsys Manufacturer |
|
Microchip
|
| Architecture |
|
VOLTAGE-FEEDBACK
|
| Common-mode Reject Ratio-Min |
|
60 dB
|
| Common-mode Reject Ratio-Nom |
|
76 dB
|
| Frequency Compensation |
|
YES
|
| Input Offset Voltage-Max |
|
4500 µV
|
| JESD-30 Code |
|
S-PDSO-G8
|
| JESD-609 Code |
|
e3
|
| Length |
|
3 mm
|
| Low-Bias |
|
NO
|
| Low-Offset |
|
NO
|
| Micropower |
|
YES
|
| Number of Functions |
|
2
|
| Number of Terminals |
|
8
|
| Operating Temperature-Max |
|
125 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Package Body Material |
|
PLASTIC/EPOXY
|
| Package Code |
|
TSSOP
|
| Package Equivalence Code |
|
TSSOP8,.19
|
| Package Shape |
|
SQUARE
|
| Package Style |
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
| Packing Method |
|
TR
|
| Power |
|
NO
|
| Programmable Power |
|
NO
|
| Screening Level |
|
AEC-Q100; TS 16949
|
| Seated Height-Max |
|
1.1 mm
|
| Slew Rate-Nom |
|
0.6 V/us
|
| Supply Current-Max |
|
0.34 mA
|
| Supply Voltage Limit-Max |
|
7 V
|
| Supply Voltage-Nom (Vsup) |
|
5 V
|
| Surface Mount |
|
YES
|
| Technology |
|
CMOS
|
| Temperature Grade |
|
AUTOMOTIVE
|
| Terminal Finish |
|
MATTE TIN
|
| Terminal Form |
|
GULL WING
|
| Terminal Pitch |
|
0.65 mm
|
| Terminal Position |
|
DUAL
|
| Unity Gain BW-Nom |
|
1000
|
| Voltage Gain-Min |
|
25118.86
|
| Wideband |
|
NO
|
| Width |
|
3 mm
|
|
|
|
Compare MCP6002T-I/P with alternatives
Compare MCP6002T-E/MSVAO with alternatives