MCP631-E/MNY vs TSV992IDT feature comparison

MCP631-E/MNY Microchip Technology Inc

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TSV992IDT STMicroelectronics

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Part Life Cycle Code Active Active
Ihs Manufacturer MICROCHIP TECHNOLOGY INC STMICROELECTRONICS
Part Package Code DFN SOIC
Package Description HVSON, SOP-8
Pin Count 8 8
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.33.00.01 8542.33.00.01
Amplifier Type OPERATIONAL AMPLIFIER OPERATIONAL AMPLIFIER
Average Bias Current-Max (IIB) 0.005 µA 0.0001 µA
Common-mode Reject Ratio-Nom 78 dB 82 dB
Input Offset Voltage-Max 8000 µV 7500 µV
JESD-30 Code R-PDSO-N8 R-PDSO-G8
Length 3 mm 4.9 mm
Number of Functions 1 2
Number of Terminals 8 8
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code HVSON SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE SMALL OUTLINE
Seated Height-Max 0.8 mm 1.75 mm
Slew Rate-Nom 10 V/us 10 V/us
Supply Voltage Limit-Max 6.5 V 6 V
Supply Voltage-Nom (Vsup) 2.5 V 3.3 V
Surface Mount YES YES
Technology CMOS BICMOS
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Form NO LEAD GULL WING
Terminal Pitch 0.5 mm 1.27 mm
Terminal Position DUAL DUAL
Unity Gain BW-Nom 24000 20000
Width 2 mm 3.9 mm
Base Number Matches 1 1
Rohs Code Yes
Factory Lead Time 20 Weeks
Samacsys Manufacturer STMicroelectronics
Architecture VOLTAGE-FEEDBACK
Bias Current-Max (IIB) @25C 0.00001 µA
Frequency Compensation YES
JESD-609 Code e4
Low-Bias YES
Low-Offset NO
Micropower NO
Moisture Sensitivity Level 1
Package Equivalence Code SOP8,.25
Packing Method TAPE AND REEL
Peak Reflow Temperature (Cel) 260
Power NO
Programmable Power NO
Qualification Status Not Qualified
Supply Current-Max 2.2 mA
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au)
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Voltage Gain-Min 5600
Wideband NO

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