MCP6S26T-I/ST
vs
MCP3914A2-E/MV
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
| Part Package Code |
TSSOP
|
|
| Package Description |
TSSOP, TSSOP14,.25
|
HVQCCN,
|
| Pin Count |
14
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.33.00.01
|
8542.39.00.01
|
| Factory Lead Time |
4 Weeks
|
|
| Samacsys Manufacturer |
Microchip
|
|
| Analog IC - Other Type |
ANALOG CIRCUIT
|
ANALOG CIRCUIT
|
| JESD-30 Code |
R-PDSO-G14
|
S-PQCC-N40
|
| JESD-609 Code |
e3
|
|
| Length |
5 mm
|
5 mm
|
| Moisture Sensitivity Level |
1
|
|
| Number of Channels |
6
|
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
14
|
40
|
| Operating Temperature-Max |
85 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TSSOP
|
HVQCCN
|
| Package Equivalence Code |
TSSOP14,.25
|
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Qualification Status |
Not Qualified
|
|
| Screening Level |
TS 16949
|
|
| Seated Height-Max |
1.1 mm
|
0.55 mm
|
| Supply Current-Max (Isup) |
1.35 mA
|
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
3.6 V
|
| Supply Voltage-Min (Vsup) |
2.5 V
|
2.7 V
|
| Supply Voltage-Nom (Vsup) |
4 V
|
3 V
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
INDUSTRIAL
|
AUTOMOTIVE
|
| Terminal Finish |
Matte Tin (Sn)
|
|
| Terminal Form |
GULL WING
|
NO LEAD
|
| Terminal Pitch |
0.65 mm
|
0.4 mm
|
| Terminal Position |
DUAL
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
|
| Width |
4.4 mm
|
5 mm
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare MCP6S26T-I/ST with alternatives
Compare MCP3914A2-E/MV with alternatives