MEC1428-I/NU-C1
vs
MEC1428-SZ-C1
feature comparison
Rohs Code |
Yes
|
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
Package Description |
VTQFP-128
|
WFBGA-144
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
5A992.C
|
5A992.C
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Factory Lead Time |
4 Weeks
|
7 Weeks
|
Samacsys Manufacturer |
Microchip
|
Microchip
|
Additional Feature |
ALSO OPERATES AT 3.3V NOMINAL SUPPLY VOLTAGE
|
ALSO OPERATES AT 3.3V NOMINAL SUPPLY VOLTAGE
|
JESD-30 Code |
S-PQFP-G128
|
S-PBGA-B144
|
JESD-609 Code |
e3
|
e1
|
Length |
14 mm
|
9 mm
|
Moisture Sensitivity Level |
3
|
|
Number of Terminals |
128
|
144
|
Operating Temperature-Max |
85 °C
|
70 °C
|
Operating Temperature-Min |
-40 °C
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
TFQFP
|
VFBGA
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
FLATPACK, THIN PROFILE, FINE PITCH
|
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
Peak Reflow Temperature (Cel) |
260
|
|
Seated Height-Max |
1.2 mm
|
0.8 mm
|
Supply Voltage-Max |
1.89 V
|
1.89 V
|
Supply Voltage-Min |
1.71 V
|
1.71 V
|
Supply Voltage-Nom |
1.8 V
|
1.8 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
Terminal Finish |
MATTE TIN
|
TIN SILVER COPPER
|
Terminal Form |
GULL WING
|
BALL
|
Terminal Pitch |
0.4 mm
|
0.65 mm
|
Terminal Position |
QUAD
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
30
|
|
Width |
14 mm
|
9 mm
|
uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR CIRCUIT
|
MICROPROCESSOR CIRCUIT
|
Base Number Matches |
1
|
2
|
|
|
|
Compare MEC1428-I/NU-C1 with alternatives
Compare MEC1428-SZ-C1 with alternatives