MIC5319-2.8YML
vs
MIC5319-2.7YD5
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Transferred
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICREL INC
|
| Package Description |
2 X 2 MM, LEAD FREE, MLF-6
|
LEAD FREE, MO-193, TSOT-23, 5 PIN
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.39.00.01
|
|
| Dropout Voltage1-Max |
0.4 V
|
0.4 V
|
| Input Voltage-Max |
5.5 V
|
5.5 V
|
| Input Voltage-Min |
2.5 V
|
2.5 V
|
| JESD-30 Code |
S-PDSO-N6
|
R-PDSO-G5
|
| JESD-609 Code |
e3
|
e4
|
| Length |
2 mm
|
2.9 mm
|
| Moisture Sensitivity Level |
2
|
1
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
6
|
5
|
| Operating Temperature TJ-Max |
125 °C
|
125 °C
|
| Operating Temperature TJ-Min |
-40 °C
|
-40 °C
|
| Output Current1-Max |
0.5 A
|
0.5 A
|
| Output Voltage1-Max |
2.856 V
|
2.754 V
|
| Output Voltage1-Min |
2.744 V
|
2.646 V
|
| Output Voltage1-Nom |
2.8 V
|
2.7 V
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
HVSON
|
VSSOP
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
260
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Regulator Type |
FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR
|
FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR
|
| Seated Height-Max |
0.9 mm
|
1 mm
|
| Surface Mount |
YES
|
YES
|
| Terminal Finish |
Tin (Sn)
|
Nickel/Palladium/Gold (Ni/Pd/Au)
|
| Terminal Form |
NO LEAD
|
GULL WING
|
| Terminal Pitch |
0.65 mm
|
0.95 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
40
|
| Voltage Tolerance-Max |
2%
|
2%
|
| Width |
2 mm
|
1.6 mm
|
| Base Number Matches |
2
|
2
|
| Adjustability |
|
FIXED
|
| Dropout Voltage1-Nom |
|
0.2 V
|
| Input Voltage Absolute-Max |
|
6 V
|
| Line Regulation-Max |
|
0.0146%
|
| Load Regulation-Max |
|
0.0135%
|
| Number of Outputs |
|
1
|
| Package Equivalence Code |
|
TSOP5/6,.11,37
|
| Technology |
|
CMOS
|
|
|
|
Compare MIC5319-2.8YML with alternatives