MM74HC137M vs 74HC137DB,118 feature comparison

MM74HC137M Texas Instruments

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74HC137DB,118 NXP Semiconductors

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Rohs Code No Yes
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer NATIONAL SEMICONDUCTOR CORP NXP SEMICONDUCTORS
Package Description SOP, SOP16,.25 SSOP,
Reach Compliance Code unknown unknown
ECCN Code EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature ADDRESS LATCHES; 2 ENABLE INPUTS ADDRESS LATCHES
Family HC/UH HC/UH
Input Conditioning LATCHED LATCHED
JESD-30 Code R-PDSO-G16 R-PDSO-G16
JESD-609 Code e0 e4
Length 9.9 mm 6.2 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type 3-LINE TO 8-LINE DECODER 3-LINE TO 8-LINE DECODER
Number of Functions 1 1
Number of Terminals 16 16
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Output Polarity INVERTED INVERTED
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SSOP
Package Equivalence Code SOP16,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE, SHRINK PITCH
Propagation Delay (tpd) 60 ns 285 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.75 mm 2 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL AUTOMOTIVE
Terminal Finish TIN LEAD Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 0.65 mm
Terminal Position DUAL DUAL
Width 3.9 mm 5.3 mm
Base Number Matches 2 2
Part Package Code SSOP1
Pin Count 16
Manufacturer Package Code SOT338-1
Moisture Sensitivity Level 1
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

Compare MM74HC137M with alternatives

Compare 74HC137DB,118 with alternatives