MOR01WJ0912B00 vs 261-9.1K feature comparison

MOR01WJ0912B00 Royal Electronic Factory (Thailand) Co Ltd

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261-9.1K Xicon Passive Components

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Rohs Code Yes No
Part Life Cycle Code Active Contact Manufacturer
Ihs Manufacturer ROYAL ELECTRONIC FTY CO LTD XICON PASSIVE COMPONENTS
Package Description AXIAL LEADED
Reach Compliance Code compliant unknown
Construction Ceramic Core Cylindrical
Lead Diameter 0.7 mm 0.7 mm
Lead Length 25 mm 28 mm
Mounting Feature THROUGH HOLE MOUNT
Number of Terminals 2 2
Operating Temperature-Max 235 °C 235 °C
Operating Temperature-Min -55 °C -55 °C
Package Diameter 5 mm 5 mm
Package Length 12 mm 12 mm
Package Style Axial Axial
Packing Method BULK Bulk
Rated Power Dissipation (P) 1 W 1 W
Rated Temperature 70 °C
Resistance 9100 Ω 9100 Ω
Resistor Type FIXED RESISTOR FIXED RESISTOR
Surface Mount NO
Technology METAL OXIDE FILM METAL OXIDE FILM
Temperature Coefficient 350 ppm/°C 350 ppm/°C
Terminal Shape WIRE
Tolerance 5% 5%
Working Voltage 350 V 350 V
Base Number Matches 1 1
ECCN Code EAR99
Package Shape CYLINDRICAL PACKAGE
Series MO

Compare MOR01WJ0912B00 with alternatives

Compare 261-9.1K with alternatives