MPC5554MZP132 vs MPC5554AVR132 feature comparison

MPC5554MZP132 Rochester Electronics LLC

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MPC5554AVR132 Freescale Semiconductor

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Pbfree Code Yes
Rohs Code No Yes
Part Life Cycle Code Active Transferred
Ihs Manufacturer ROCHESTER ELECTRONICS LLC FREESCALE SEMICONDUCTOR INC
Part Package Code BGA BGA
Package Description 27 X 27 MM, 1 MM PITCH, PLASTIC, MS-034AAL-1, TEBGA-416 HBGA, BGA416,26X26,40
Pin Count 416 416
Reach Compliance Code unknown compliant
Has ADC YES YES
Address Bus Width 24 24
Bit Size 32 32
Clock Frequency-Max 20 MHz 20 MHz
DAC Channels NO NO
DMA Channels NO NO
External Data Bus Width 32 32
JESD-30 Code S-PBGA-B416 S-PBGA-B416
JESD-609 Code e0
Length 27 mm 27 mm
Moisture Sensitivity Level 3
Number of Terminals 416 416
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
PWM Channels YES YES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA HBGA
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY, HEAT SINK/SLUG
Peak Reflow Temperature (Cel) 245
ROM Programmability FLASH FLASH
Seated Height-Max 2.55 mm 2.55 mm
Speed 132 MHz 132 MHz
Supply Voltage-Max 1.65 V 1.65 V
Supply Voltage-Min 1.35 V 1.35 V
Supply Voltage-Nom 1.5 V 1.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE MILITARY
Terminal Finish TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
Width 27 mm 27 mm
uPs/uCs/Peripheral ICs Type MICROCONTROLLER MICROCONTROLLER
Base Number Matches 3 2
ECCN Code 3A001.A.2.C
HTS Code 8542.31.00.01
Additional Feature IT ALSO REQUIRES 3.3V SUPPLY
On Chip Program ROM Width 8
Package Equivalence Code BGA416,26X26,40
Qualification Status Not Qualified
RAM (bytes) 65536
ROM (words) 2097152

Compare MPC5554MZP132 with alternatives

Compare MPC5554AVR132 with alternatives