MPC565CZP40 vs MPC563MZP56R2 feature comparison

MPC565CZP40 NXP Semiconductors

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MPC563MZP56R2 NXP Semiconductors

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Rohs Code No No
Part Life Cycle Code Not Recommended Not Recommended
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Package Description 27 X 27 MM, 1 MM PITCH, PLASTIC, MO-151AAL-1, BGA-388 27 X 27 MM, 1 MM PITCH, PLASTIC, MO-151, BGA-388
Reach Compliance Code unknown not_compliant
ECCN Code 3A991.A.2 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Factory Lead Time 12 Weeks 12 Weeks
Samacsys Manufacturer NXP NXP
Has ADC NO NO
Additional Feature ALSO REQUIRES 5V SUPPLY
Address Bus Width 24 24
Bit Size 32 32
Clock Frequency-Max 84 MHz 20 MHz
DAC Channels NO NO
DMA Channels NO NO
External Data Bus Width 32 32
JESD-30 Code S-PBGA-B388 S-PBGA-B388
JESD-609 Code e0 e0
Length 27 mm 27 mm
Moisture Sensitivity Level 3 3
Number of I/O Lines 16
Number of Terminals 388 388
On Chip Program ROM Width 8 8
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
PWM Channels YES NO
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA388,26X26,40 BGA388,26X26,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 240 240
Qualification Status Not Qualified Not Qualified
RAM (bytes) 36864 32768
ROM (words) 1048576 524288
ROM Programmability FLASH FLASH
Seated Height-Max 2.55 mm 2.55 mm
Speed 40 MHz 56 MHz
Supply Current-Max 120 mA
Supply Voltage-Max 2.7 V 2.7 V
Supply Voltage-Min 2.6 V 2.5 V
Supply Voltage-Nom 2.6 V 2.6 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL AUTOMOTIVE
Terminal Finish Tin/Lead (Sn/Pb) Tin/Lead/Silver (Sn/Pb/Ag)
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 27 mm 27 mm
uPs/uCs/Peripheral ICs Type MICROCONTROLLER, RISC MICROCONTROLLER, RISC
Base Number Matches 5 4

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