MPC565CZP40
vs
MPC566MVR56
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Not Recommended
Ihs Manufacturer
MOTOROLA INC
NXP SEMICONDUCTORS
Package Description
27 X 27 MM, 1 MM PITCH, PLASTIC, MO-151AAL-1, BGA-388
27 X 27 MM, 1 MM PITCH, PLASTIC, MO-151AAL-1, BGA-388
Reach Compliance Code
unknown
compliant
ECCN Code
3A991.A.2
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Has ADC
NO
NO
Additional Feature
ALSO REQUIRES 5V SUPPLY
ALSO REQUIRES 5V SUPPLY
Address Bus Width
24
24
Bit Size
32
32
Clock Frequency-Max
84 MHz
84 MHz
DAC Channels
NO
NO
DMA Channels
NO
NO
External Data Bus Width
32
32
JESD-30 Code
S-PBGA-B388
S-PBGA-B388
Length
27 mm
27 mm
Number of I/O Lines
Number of Terminals
388
388
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
PWM Channels
YES
YES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Qualification Status
Not Qualified
Not Qualified
ROM Programmability
FLASH
FLASH
Seated Height-Max
2.55 mm
2.55 mm
Speed
40 MHz
56 MHz
Supply Voltage-Max
2.7 V
2.7 V
Supply Voltage-Min
2.5 V
2.5 V
Supply Voltage-Nom
2.6 V
2.6 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
AUTOMOTIVE
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Width
27 mm
27 mm
uPs/uCs/Peripheral ICs Type
MICROCONTROLLER, RISC
MICROCONTROLLER, RISC
Base Number Matches
5
2
Rohs Code
Yes
Factory Lead Time
12 Weeks
Samacsys Manufacturer
NXP
JESD-609 Code
e1
Moisture Sensitivity Level
3
On Chip Program ROM Width
8
Package Equivalence Code
BGA388,26X26,40
Peak Reflow Temperature (Cel)
260
RAM (bytes)
36864
ROM (words)
1048576
Supply Current-Max
230 mA
Terminal Finish
Tin/Silver/Copper (Sn/Ag/Cu)
Time@Peak Reflow Temperature-Max (s)
40
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