MPC565CZP56
vs
MPC566CVR56
feature comparison
Part Life Cycle Code |
Contact Manufacturer
|
Not Recommended
|
Ihs Manufacturer |
ROCHESTER ELECTRONICS LLC
|
NXP SEMICONDUCTORS
|
Part Package Code |
BGA
|
|
Pin Count |
388
|
|
Reach Compliance Code |
unknown
|
compliant
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER, RISC
|
MICROCONTROLLER, RISC
|
Base Number Matches |
5
|
2
|
Rohs Code |
|
Yes
|
Package Description |
|
27 X 27 MM, 1 MM PITCH, PLASTIC, MO-151AAL-1, BGA-388
|
ECCN Code |
|
3A991.A.2
|
Factory Lead Time |
|
26 Weeks
|
Samacsys Manufacturer |
|
NXP
|
Has ADC |
|
NO
|
Additional Feature |
|
ALSO REQUIRES 5V SUPPLY
|
Address Bus Width |
|
24
|
Bit Size |
|
32
|
Clock Frequency-Max |
|
84 MHz
|
DAC Channels |
|
NO
|
DMA Channels |
|
NO
|
External Data Bus Width |
|
32
|
JESD-30 Code |
|
S-PBGA-B388
|
JESD-609 Code |
|
e1
|
Length |
|
27 mm
|
Moisture Sensitivity Level |
|
3
|
Number of I/O Lines |
|
|
Number of Terminals |
|
388
|
On Chip Program ROM Width |
|
8
|
Operating Temperature-Max |
|
85 °C
|
Operating Temperature-Min |
|
-40 °C
|
PWM Channels |
|
YES
|
Package Body Material |
|
PLASTIC/EPOXY
|
Package Code |
|
BGA
|
Package Equivalence Code |
|
BGA388,26X26,40
|
Package Shape |
|
SQUARE
|
Package Style |
|
GRID ARRAY
|
Peak Reflow Temperature (Cel) |
|
260
|
Qualification Status |
|
Not Qualified
|
RAM (bytes) |
|
36864
|
ROM (words) |
|
1048576
|
ROM Programmability |
|
FLASH
|
Seated Height-Max |
|
2.55 mm
|
Speed |
|
56 MHz
|
Supply Current-Max |
|
230 mA
|
Supply Voltage-Max |
|
2.7 V
|
Supply Voltage-Min |
|
2.6 V
|
Supply Voltage-Nom |
|
2.6 V
|
Surface Mount |
|
YES
|
Technology |
|
CMOS
|
Temperature Grade |
|
INDUSTRIAL
|
Terminal Finish |
|
Tin/Silver/Copper (Sn/Ag/Cu)
|
Terminal Form |
|
BALL
|
Terminal Pitch |
|
1 mm
|
Terminal Position |
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
|
40
|
Width |
|
27 mm
|
|
|
|
Compare MPC565CZP56 with alternatives
Compare MPC566CVR56 with alternatives