MPC565CZP56 vs MPC566CVR56 feature comparison

MPC565CZP56 Rochester Electronics LLC

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MPC566CVR56 NXP Semiconductors

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Part Life Cycle Code Contact Manufacturer Not Recommended
Ihs Manufacturer ROCHESTER ELECTRONICS LLC NXP SEMICONDUCTORS
Part Package Code BGA
Pin Count 388
Reach Compliance Code unknown compliant
HTS Code 8542.31.00.01 8542.31.00.01
uPs/uCs/Peripheral ICs Type MICROCONTROLLER, RISC MICROCONTROLLER, RISC
Base Number Matches 5 2
Rohs Code Yes
Package Description 27 X 27 MM, 1 MM PITCH, PLASTIC, MO-151AAL-1, BGA-388
ECCN Code 3A991.A.2
Factory Lead Time 26 Weeks
Samacsys Manufacturer NXP
Has ADC NO
Additional Feature ALSO REQUIRES 5V SUPPLY
Address Bus Width 24
Bit Size 32
Clock Frequency-Max 84 MHz
DAC Channels NO
DMA Channels NO
External Data Bus Width 32
JESD-30 Code S-PBGA-B388
JESD-609 Code e1
Length 27 mm
Moisture Sensitivity Level 3
Number of I/O Lines
Number of Terminals 388
On Chip Program ROM Width 8
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
PWM Channels YES
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA388,26X26,40
Package Shape SQUARE
Package Style GRID ARRAY
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified
RAM (bytes) 36864
ROM (words) 1048576
ROM Programmability FLASH
Seated Height-Max 2.55 mm
Speed 56 MHz
Supply Current-Max 230 mA
Supply Voltage-Max 2.7 V
Supply Voltage-Min 2.6 V
Supply Voltage-Nom 2.6 V
Surface Mount YES
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) 40
Width 27 mm

Compare MPC565CZP56 with alternatives

Compare MPC566CVR56 with alternatives