MPC566MVR56 vs MPC562MZP56 feature comparison

MPC566MVR56 Freescale Semiconductor

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MPC562MZP56 Motorola Mobility LLC

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Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer FREESCALE SEMICONDUCTOR INC MOTOROLA INC
Part Package Code BGA BGA
Package Description 27 X 27 MM, 1 MM PITCH, PLASTIC, MO-151AAL-1, BGA-388 BGA, BGA388,26X26,40
Pin Count 388 388
Reach Compliance Code compliant unknown
ECCN Code 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Samacsys Manufacturer NXP
Has ADC NO NO
Additional Feature ALSO REQUIRES 5V SUPPLY
Address Bus Width 24 24
Bit Size 32 32
Clock Frequency-Max 84 MHz 20 MHz
DAC Channels NO NO
DMA Channels NO NO
External Data Bus Width 32 32
JESD-30 Code S-PBGA-B388 S-PBGA-B388
JESD-609 Code e1
Length 27 mm 27 mm
Moisture Sensitivity Level 3
Number of I/O Lines 16
Number of Terminals 388 388
On Chip Program ROM Width 8
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
PWM Channels YES NO
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified Not Qualified
ROM (words) 1048576
ROM Programmability FLASH FLASH
Seated Height-Max 2.55 mm 2.55 mm
Speed 56 MHz 56 MHz
Supply Voltage-Max 2.7 V 2.7 V
Supply Voltage-Min 2.5 V 2.5 V
Supply Voltage-Nom 2.6 V 2.6 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Finish TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 40
Width 27 mm 27 mm
uPs/uCs/Peripheral ICs Type MICROCONTROLLER, RISC MICROCONTROLLER, RISC
Base Number Matches 2 4
Package Equivalence Code BGA388,26X26,40
RAM (bytes) 32768

Compare MPC566MVR56 with alternatives

Compare MPC562MZP56 with alternatives