MPC8245TZU266D vs MCF5485CVR200 feature comparison

MPC8245TZU266D NXP Semiconductors

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MCF5485CVR200 NXP Semiconductors

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Rohs Code No Yes
Part Life Cycle Code Obsolete Not Recommended
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Package Description 35 X 35 MM, 1.65 MM HEIGHT, 1.27 MM PITCH, TBGA-352 27 X 27 MM, 1 MM PITCH, MS-034AAL-1, PBGA-388
Reach Compliance Code not_compliant compliant
ECCN Code 3A991.A.2 5A002.A.1
HTS Code 8542.31.00.01 8542.31.00.01
Factory Lead Time 2 Days 13 Weeks
Samacsys Manufacturer NXP NXP
Additional Feature ALSO OPERATES AT 2V SUPPLY
Address Bus Width 32
Bit Size 32 32
Boundary Scan YES YES
Clock Frequency-Max 66 MHz 66.67 MHz
External Data Bus Width 32
Format FLOATING POINT FLOATING POINT
Integrated Cache YES YES
JESD-30 Code S-PBGA-B352 S-PBGA-B388
JESD-609 Code e0 e1
Length 35 mm 27 mm
Low Power Mode YES YES
Moisture Sensitivity Level 3 3
Number of Terminals 352 388
Operating Temperature-Max 105 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA BGA
Package Equivalence Code BGA352,26X26,50
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY
Peak Reflow Temperature (Cel) 220 260
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.65 mm 2.55 mm
Speed 266 MHz 200 MHz
Supply Voltage-Max 1.9 V 3.6 V
Supply Voltage-Min 1.7 V 3 V
Supply Voltage-Nom 1.8 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish Tin/Lead/Silver (Sn/Pb/Ag) Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 40
Width 35 mm 27 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Base Number Matches 1 1

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