MPC8245TZU266D vs MPC8245LZU266D feature comparison

MPC8245TZU266D NXP Semiconductors

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MPC8245LZU266D NXP Semiconductors

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Package Description 35 X 35 MM, 1.65 MM HEIGHT, 1.27 MM PITCH, TBGA-352 35 X 35 MM, 1.65 MM HEIGHT, 1.27 MM PITCH, TBGA-352
Reach Compliance Code not_compliant unknown
ECCN Code 3A991.A.2 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Factory Lead Time 2 Days 2 Days
Samacsys Manufacturer NXP NXP
Additional Feature ALSO OPERATES AT 2V SUPPLY
Address Bus Width 32 32
Bit Size 32 32
Boundary Scan YES YES
Clock Frequency-Max 66 MHz 66 MHz
External Data Bus Width 32 32
Format FLOATING POINT FLOATING POINT
Integrated Cache YES YES
JESD-30 Code S-PBGA-B352 S-PBGA-B352
JESD-609 Code e0 e0
Length 35 mm 35 mm
Low Power Mode YES YES
Moisture Sensitivity Level 3 3
Number of Terminals 352 352
Operating Temperature-Max 105 °C 105 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA LBGA
Package Equivalence Code BGA352,26X26,50 BGA352,26X26,50
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Cel) 220 220
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.65 mm 1.65 mm
Speed 266 MHz 266 MHz
Supply Voltage-Max 1.9 V 2.1 V
Supply Voltage-Min 1.7 V 1.7 V
Supply Voltage-Nom 1.8 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL OTHER
Terminal Finish Tin/Lead/Silver (Sn/Pb/Ag) Tin/Lead (Sn/Pb)
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 35 mm 35 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Base Number Matches 1 1

Compare MPC8245TZU266D with alternatives

Compare MPC8245LZU266D with alternatives