MPC8358EVVAGDGA vs MPC8360ZUALFHA feature comparison

MPC8358EVVAGDGA NXP Semiconductors

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MPC8360ZUALFHA Freescale Semiconductor

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Rohs Code Yes No
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer NXP SEMICONDUCTORS FREESCALE SEMICONDUCTOR INC
Package Description 37.50 X 37.50 MM, 1.46 MM HEIGHT, 1 MM PITCH, LEAD FREE, TBGA-740 37.50 X 37.50 MM, 1.46 MM HEIGHT, 1 MM PITCH, TBGA-740
Reach Compliance Code compliant not_compliant
ECCN Code 5A002.A.1 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Samacsys Manufacturer NXP
Address Bus Width 32 32
Bit Size 32 32
Boundary Scan YES YES
Clock Frequency-Max 66.67 MHz 66.67 MHz
External Data Bus Width 32 32
Format FLOATING POINT FLOATING POINT
Integrated Cache YES YES
JESD-30 Code S-PBGA-B740 S-PBGA-B740
JESD-609 Code e2 e0
Length 37.5 mm 37.5 mm
Low Power Mode YES YES
Moisture Sensitivity Level 3 3
Number of Terminals 740 740
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA LBGA
Package Equivalence Code BGA740,37X37,40 BGA740,37X37,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Cel) 260 260
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.69 mm 1.69 mm
Speed 400 MHz 667 MHz
Supply Voltage-Max 1.26 V 1.35 V
Supply Voltage-Min 1.14 V 1.25 V
Supply Voltage-Nom 1.2 V 1.3 V
Surface Mount YES YES
Technology CMOS CMOS
Terminal Finish Tin/Silver (Sn/Ag) Tin/Lead/Silver (Sn/Pb/Ag)
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 40 40
Width 37.5 mm 37.5 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Base Number Matches 1 1
Pbfree Code No
Part Package Code BGA
Pin Count 740

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Compare MPC8360ZUALFHA with alternatives