MPC852TZT50 vs MC9328MX1VM20 feature comparison

MPC852TZT50 Motorola Mobility LLC

Buy Now Datasheet

MC9328MX1VM20 NXP Semiconductors

Buy Now Datasheet
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer MOTOROLA INC NXP SEMICONDUCTORS
Part Package Code BGA
Package Description BGA, BGA256,16X16,50 14 X 14 MM, 1.30 MM HEIGHT, 0.80 MM PITCH, ROHS COMPLIANT, MAPBGA-256
Pin Count 256
Reach Compliance Code unknown compliant
ECCN Code 3A991.A.2 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Additional Feature ALSO REQUIRES 3.3V SUPPLY ALSO REQUIRES 3.3V SUPPLY
Address Bus Width 32 25
Bit Size 32 32
Boundary Scan YES YES
Clock Frequency-Max 66 MHz 16 MHz
External Data Bus Width 32 32
Format FIXED POINT FIXED POINT
Integrated Cache YES YES
JESD-30 Code S-PBGA-B256 S-PBGA-B256
Length 23 mm 14 mm
Low Power Mode YES YES
Number of Terminals 256 256
Operating Temperature-Max 95 °C 70 °C
Operating Temperature-Min
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA LFBGA
Package Equivalence Code BGA256,16X16,50
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY, LOW PROFILE, FINE PITCH
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.54 mm 1.6 mm
Speed 50 MHz 200 MHz
Supply Voltage-Max 1.9 V 2 V
Supply Voltage-Min 1.7 V 1.8 V
Supply Voltage-Nom 1.8 V 1.9 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER COMMERCIAL
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Width 23 mm 14 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Base Number Matches 3 4
Rohs Code Yes
Samacsys Manufacturer NXP
JESD-609 Code e1
Moisture Sensitivity Level 3
Peak Reflow Temperature (Cel) 260
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Time@Peak Reflow Temperature-Max (s) 40

Compare MPC852TZT50 with alternatives

Compare MC9328MX1VM20 with alternatives