MPC852TZT80A vs AT75C221-C256 feature comparison

MPC852TZT80A NXP Semiconductors

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AT75C221-C256 Atmel Corporation

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Rohs Code No No
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer NXP SEMICONDUCTORS ATMEL CORP
Package Description PLASTIC, BGA-256 BGA, BGA256,20X20,50
Reach Compliance Code unknown compliant
ECCN Code 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Factory Lead Time 4 Weeks
Additional Feature ALSO REQUIRES 3.3V SUPPLY
Address Bus Width 32 24
Bit Size 32 32
Boundary Scan YES YES
Clock Frequency-Max 66 MHz 16 MHz
External Data Bus Width 32 32
Format FIXED POINT FIXED POINT
Integrated Cache YES
JESD-30 Code S-PBGA-B256 S-PBGA-B256
JESD-609 Code e0 e0
Length 23 mm 24 mm
Low Power Mode YES NO
Moisture Sensitivity Level 3
Number of Terminals 256 256
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA256,16X16,50 BGA256,20X20,50
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 220
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.54 mm 2.34 mm
Speed 80 MHz 40 MHz
Supply Voltage-Max 1.9 V
Supply Voltage-Min 1.7 V
Supply Voltage-Nom 1.8 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Terminal Finish Tin/Lead (Sn/Pb) TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
Width 23 mm 24 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Base Number Matches 2 2
Pbfree Code No
Part Package Code BGA
Pin Count 256
Operating Temperature-Max 70 °C
Operating Temperature-Min
Temperature Grade COMMERCIAL

Compare MPC852TZT80A with alternatives

Compare AT75C221-C256 with alternatives