MPC8541ECPXAPEX vs MC7448VS1600LC feature comparison

MPC8541ECPXAPEX NXP Semiconductors

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MC7448VS1600LC Freescale Semiconductor

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS FREESCALE SEMICONDUCTOR INC
Package Description BGA, 25 X 25 MM, 1.80 MM HEIGHT, 1.27 MM PITCH, ROHS COMPLIANT, HCTE, CERAMIC, LGA-360
Reach Compliance Code unknown not_compliant
ECCN Code 3A991.A.2 3A991
HTS Code 8542.31.00.01 8542.31.00.01
Additional Feature LOW POWER TAKEN FROM SLEEP MODE LOW POWER TAKEN FROM SLEEP MODE
Address Bus Width 36 36
Bit Size 32 32
Boundary Scan YES YES
Clock Frequency-Max 200 MHz 200 MHz
External Data Bus Width 64 64
Format FLOATING POINT FLOATING POINT
Integrated Cache YES YES
JESD-30 Code S-CBGA-B360 S-CBGA-B360
Length 25 mm 25 mm
Low Power Mode YES YES
Number of Terminals 360 360
Operating Temperature-Max 70 °C 105 °C
Operating Temperature-Min
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
Package Code BGA BGA
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.4 mm 1.8 mm
Speed 1600 MHz 1600 MHz
Supply Voltage-Max 1.3 V 1.3 V
Supply Voltage-Min 1.2 V 1.2 V
Supply Voltage-Nom 1.25 V 1.25 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL OTHER
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Width 25 mm 25 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Base Number Matches 1 1
Rohs Code Yes
Part Package Code LGA
Pin Count 360
Moisture Sensitivity Level 1
Package Equivalence Code LGA360,19X19,50
Peak Reflow Temperature (Cel) 245
Time@Peak Reflow Temperature-Max (s) 30

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Compare MC7448VS1600LC with alternatives