MPC8541ECPXAPEX
vs
MPC8541CVTAQEX
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
NXP SEMICONDUCTORS
|
| Package Description |
BGA,
|
BGA,
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
3A991.A.2
|
3A991.A.2
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Additional Feature |
LOW POWER TAKEN FROM SLEEP MODE
|
|
| Address Bus Width |
36
|
|
| Bit Size |
32
|
|
| Boundary Scan |
YES
|
|
| Clock Frequency-Max |
200 MHz
|
|
| External Data Bus Width |
64
|
|
| Format |
FLOATING POINT
|
|
| Integrated Cache |
YES
|
|
| JESD-30 Code |
S-CBGA-B360
|
|
| Length |
25 mm
|
|
| Low Power Mode |
YES
|
|
| Number of Terminals |
360
|
|
| Operating Temperature-Max |
70 °C
|
|
| Operating Temperature-Min |
|
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
|
| Package Code |
BGA
|
|
| Package Shape |
SQUARE
|
|
| Package Style |
GRID ARRAY
|
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
2.4 mm
|
|
| Speed |
1600 MHz
|
|
| Supply Voltage-Max |
1.3 V
|
|
| Supply Voltage-Min |
1.2 V
|
|
| Supply Voltage-Nom |
1.25 V
|
|
| Surface Mount |
YES
|
|
| Technology |
CMOS
|
|
| Temperature Grade |
COMMERCIAL
|
|
| Terminal Form |
BALL
|
|
| Terminal Pitch |
1.27 mm
|
|
| Terminal Position |
BOTTOM
|
|
| Width |
25 mm
|
|
| uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR, RISC
|
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare MPC8541ECPXAPEX with alternatives
Compare MPC8541CVTAQEX with alternatives