MR0D08BMA45 vs MR0D08BMA45R feature comparison

MR0D08BMA45 Everspin Technologies

Buy Now Datasheet

MR0D08BMA45R Everspin Technologies

Buy Now Datasheet
Rohs Code Yes Yes
Part Life Cycle Code Active Active
Ihs Manufacturer EVERSPIN TECHNOLOGIES INC EVERSPIN TECHNOLOGIES INC
Part Package Code BGA BGA
Package Description LFBGA, BGA48,6X8,30 LFBGA, BGA48,6X8,30
Pin Count 48 48
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Samacsys Manufacturer Everspin Technologies
Access Time-Max 45 ns 45 ns
JESD-30 Code S-PBGA-B48 S-PBGA-B48
Length 8 mm 8 mm
Memory Density 1048576 bit 1048576 bit
Memory IC Type MEMORY CIRCUIT MEMORY CIRCUIT
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 48 48
Number of Words 131072 words 131072 words
Number of Words Code 128000 128000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 128KX8 128KX8
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LFBGA LFBGA
Package Equivalence Code BGA48,6X8,30 BGA48,6X8,30
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) NOT SPECIFIED NOT SPECIFIED
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.35 mm 1.35 mm
Standby Current-Max 0.008 A 0.008 A
Supply Current-Max 0.065 mA 0.065 mA
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 3 V 3 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Form BALL BALL
Terminal Pitch 0.75 mm 0.75 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED NOT SPECIFIED
Width 8 mm 8 mm
Base Number Matches 2 1