MR256A08BMA35 vs MR256A08BCMA35R feature comparison

MR256A08BMA35 Everspin Technologies

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MR256A08BCMA35R Everspin Technologies

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Rohs Code Yes Yes
Part Life Cycle Code Active Active
Ihs Manufacturer EVERSPIN TECHNOLOGIES INC EVERSPIN TECHNOLOGIES INC
Part Package Code BGA BGA
Package Description LFBGA, BGA48,6X8,30 LFBGA, BGA48,6X8,30
Pin Count 48 48
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Access Time-Max 35 ns 35 ns
JESD-30 Code S-PBGA-B48 S-PBGA-B48
Length 8 mm 8 mm
Memory Density 262144 bit 262144 bit
Memory IC Type MEMORY CIRCUIT MEMORY CIRCUIT
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 48 48
Number of Words 32768 words 32768 words
Number of Words Code 32000 32000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Organization 32KX8 32KX8
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LFBGA LFBGA
Package Equivalence Code BGA48,6X8,30 BGA48,6X8,30
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) NOT SPECIFIED
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.35 mm 1.35 mm
Standby Current-Max 0.007 A 0.007 A
Supply Current-Max 0.065 mA 0.065 mA
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 3 V 3 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Form BALL BALL
Terminal Pitch 0.75 mm 0.75 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 8 mm 8 mm
Base Number Matches 2 1
Samacsys Manufacturer Everspin Technologies
Moisture Sensitivity Level 3

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