MR256A08BMA35 vs MR256A08BCSO35R feature comparison

MR256A08BMA35 Everspin Technologies

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MR256A08BCSO35R Everspin Technologies

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Rohs Code Yes Yes
Part Life Cycle Code Active Obsolete
Ihs Manufacturer EVERSPIN TECHNOLOGIES INC EVERSPIN TECHNOLOGIES INC
Part Package Code BGA SOIC
Package Description LFBGA, BGA48,6X8,30 SOP, SOP32,.4
Pin Count 48 32
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Access Time-Max 35 ns 35 ns
JESD-30 Code S-PBGA-B48 R-PDSO-G32
Length 8 mm 20.726 mm
Memory Density 262144 bit 262144 bit
Memory IC Type MEMORY CIRCUIT MEMORY CIRCUIT
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 48 32
Number of Words 32768 words 32768 words
Number of Words Code 32000 32000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Organization 32KX8 32KX8
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LFBGA SOP
Package Equivalence Code BGA48,6X8,30 SOP32,.4
Package Shape SQUARE RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE, FINE PITCH SMALL OUTLINE
Peak Reflow Temperature (Cel) NOT SPECIFIED NOT SPECIFIED
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.35 mm 2.286 mm
Standby Current-Max 0.007 A 0.007 A
Supply Current-Max 0.065 mA 0.075 mA
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 3 V 3 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Form BALL GULL WING
Terminal Pitch 0.75 mm 1.25 mm
Terminal Position BOTTOM DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED NOT SPECIFIED
Width 8 mm 7.505 mm
Base Number Matches 2 1

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Compare MR256A08BCSO35R with alternatives