MR256A08BMA35
vs
MR256A08BSO35
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Obsolete
|
Ihs Manufacturer |
EVERSPIN TECHNOLOGIES INC
|
EVERSPIN TECHNOLOGIES INC
|
Part Package Code |
BGA
|
SOIC
|
Package Description |
LFBGA, BGA48,6X8,30
|
SOP, SOP32,.4
|
Pin Count |
48
|
32
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.32.00.71
|
8542.32.00.71
|
Access Time-Max |
35 ns
|
35 ns
|
JESD-30 Code |
S-PBGA-B48
|
R-PDSO-G32
|
Length |
8 mm
|
20.726 mm
|
Memory Density |
262144 bit
|
262144 bit
|
Memory IC Type |
MEMORY CIRCUIT
|
MEMORY CIRCUIT
|
Memory Width |
8
|
8
|
Number of Functions |
1
|
1
|
Number of Terminals |
48
|
32
|
Number of Words |
32768 words
|
32768 words
|
Number of Words Code |
32000
|
32000
|
Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
Operating Temperature-Max |
70 °C
|
70 °C
|
Operating Temperature-Min |
|
|
Organization |
32KX8
|
32KX8
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
LFBGA
|
SOP
|
Package Equivalence Code |
BGA48,6X8,30
|
SOP32,.4
|
Package Shape |
SQUARE
|
RECTANGULAR
|
Package Style |
GRID ARRAY, LOW PROFILE, FINE PITCH
|
SMALL OUTLINE
|
Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
NOT SPECIFIED
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.35 mm
|
2.54 mm
|
Standby Current-Max |
0.007 A
|
0.007 A
|
Supply Current-Max |
0.065 mA
|
0.065 mA
|
Supply Voltage-Max (Vsup) |
3.6 V
|
3.6 V
|
Supply Voltage-Min (Vsup) |
3 V
|
3 V
|
Supply Voltage-Nom (Vsup) |
3.3 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
Terminal Form |
BALL
|
GULL WING
|
Terminal Pitch |
0.75 mm
|
1.25 mm
|
Terminal Position |
BOTTOM
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
NOT SPECIFIED
|
Width |
8 mm
|
7.505 mm
|
Base Number Matches |
2
|
2
|
|
|
|
Compare MR256A08BMA35 with alternatives
Compare MR256A08BSO35 with alternatives